中文網
繁體
简体
SUBSCRIBE
TECH
Tech Home
Semiconductors
Communications
ICT
Displays
Electric Vehicles
Sustainability
Aerospace
REGIONS
Asia Home
East Asia
Southeast Asia
South Asia
Middle East
AsiaTech Frontier
RESEARCH
OPINIONS
Opinions Home
Interviews
Commentary
Research Insights
Column
FINANCE
BIZ FOCUS
Biz Focus Home
Trending Issues
COMPUTEX
SEMICON
CES
Electronica
EVENT+
Event+ home
Featured Events
MULTIMEDIA
SUBSCRIBE
Trending
OCP
polysilicon
TSMC
AI Search
Scaling AI Glasses
Inference Era AI
Advanced Packaging
Trending
SUBSCRIBE
CONNECT WITH US
LATEST STORIES
7 days news
Taiwan Mobile lifts 2026 profit outlook on AI data center push
Aug 17, 16:54
COMMUNICATIONS
SK keyfoundry expands 8-inch capacity as China demand strains supply
Aug 17, 16:50
EAST ASIA
TSMC overseas fabs see profit flip in 1H26
Aug 17, 16:06
SEMICONDUCTORS
Lightmatter sets optical interconnect blueprint as AI hits copper wall
Aug 17, 16:03
ICT
Phison CEO sees years of NAND shortage, AI growth chance
Samsung's China sales overtake US; Nvidia not among top five customers
Record orders, yet profits squeezed: Asia-Pacific electronics supply chain caught in cost crunch
LG-Nvidia physical AI partnership speeds up as robotics chief reportedly heads to South Korea
Giant warns rising bicycle parts costs will pressure margins
China's Vertilite commits US$741M to InP laser chips for AI optical interconnects
Nvidia closing in on US$100B credit guarantee deal for OpenAI's Ohio data center
LG, Nvidia step up humanoid push with robot data factory
China battery makers rework costs as lithium prices fall and taxes rise
Taiwan extends graduate stays to 2 years to ease talent shortages
India draws 20 bids for rare earth magnet manufacturing scheme
TSMC and Micron boom drives Taiwan 'fab five's 1H26 profits
Samsung weighs Giheung R&D line for 2nm HBM foundry capacity
Nokia axes 1,600 jobs and Hangzhou R&D center in deepening China telecom retreat
Fallout from Wingtech's Nexperia rupture: the price of rebuilding China's chip supply chain
Samsung Electro-Mechanics, LG Innotek substrate lines near full capacity as AI demand rises
Anthropic, OpenAI's looming mega-IPOs heat up AI revenue race
Tata succession clouds outlook for chips, clean energy, data centers
US drone tariff tests whether allies can truly replace China
Apple reportedly builds China-specific AI model with Alibaba as Qwen partnership deepens
WaveSplitter returns to profit as AI optics demand lifts 1H revenue
Apple faces US pressure over potential Chinese memory chip sourcing
Hermes Testing's 1H26 profit more than triples on rising AI testing demand
OCP APAC 2026: When AI starts running the hardware that runs it
Topoint's high-end drill bits hit 56% share ahead of schedule, aims to double capacity by end of 2028
US tariffs and FCC curbs redraw the drone supply chain — and Taiwan sees an opening
More news
BIZ FOCUS
Jul 30, 08:00
EDOM Accelerates Edge AI Deployment with NVIDIA Technologies
Monday 1 June 2026
LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
Thursday 30 July 2026
ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging
Wednesday 29 July 2026
Arrow Drives System-Level Design, Turning Complexity into Competitive Advantage
MOST-READ
Haesung DS lands CXMT as DDR5 substrate customer, weighs panel production for DDR6
Samsung struggles to secure AI chip substrates, report says
Memory shortage could turn into a glut by 2028 as chipmakers expand
Samsung, SK Hynix prioritize DDR5 as margins near HBM levels
Exclusive: Musk pushes US solar supply chain upstream as polysilicon ambitions emerge
2027 memory capacity reportedly sold out as buyers quietly lock in supply
'Don't panic about Kimi K3': Jensen Huang claims everyone got the logic backwards
MULTIMEDIA
Jensen Huang in Seoul: Faker, BBQ and one very awkward LG chairman
OCP APAC Summit 2026
The OCP APAC Summit 2026 takes place August 11-12 at the TaiNEX2 exhibition hall in Taipei.
Lightmatter sets optical interconnect blueprint as AI hits copper wall
OCP APAC 2026: When AI starts running the hardware that runs it
OCP APAC 2026: What if AI's next efficiency breakthrough is simply moving less?
...More
EV
Wednesday 29 July 2026
Chinese brands seize 25% of Europe midsize SUV sales as BEV demand surges
Chinese automakers gain share in Europe as legacy carmakers partner to cut costs
Friday 14 August 2026
Global PMX sees semiconductor demand driving growth through 2027 as product mix shifts
Friday 14 August 2026
Porsche exits Volkswagen carbon pool, joins Xpeng
Friday 14 August 2026
TECH
Friday 14 August 2026
OCP APAC 2026: What if AI's next efficiency breakthrough is simply moving less?
OCP APAC 2026: Intel sees agentic AI shifting bottlenecks toward CPUs, memory
Thursday 13 August 2026
OCP APAC 2026: Microsoft leans on Taiwan supply chain for 'silicon-to-systems' AI buildout
Wednesday 12 August 2026
Interview: Nvidia exec on progress of CPO production and pluggable optics
Friday 7 August 2026
ASIA
Thursday 30 July 2026
China's 28nm DUV lithography enters fab validation, reportedly guided by State Council-level experts
South Korea's memory-chip exports surge 277% as system chips slip
Friday 14 August 2026
VinSpace signs SpaceX launch deal for first satellites in 2027
Friday 14 August 2026
DeepSeek raises API prices sharply as V4 Pro targets agentic AI market
Friday 14 August 2026
OPINIONS
Friday 14 August 2026
Insight: Intel raises US$20B, but its 14A ambitions may need twice as much
Analysis: Taiwan Mobile takes control of Systex to close ICT gap with Chunghwa Telecom, Far EasTone
Friday 14 August 2026
Analysis: Google's Pixel tests Android's competitive balance
Friday 14 August 2026
Interview: 'Modern warfare is a battle of PAs'–Transcom targets overseas defense, LEO satellite growth
Friday 14 August 2026
TOPICS
OCP APAC SUMMIT 2026
5G
TSMC UPDATES
GEOWATCH
SPECIAL REPORTS
Friday 14 August 2026
AI infrastructure enters multi-architecture fabric competition; Optical-copper interconnects and supply-chain coordination determine system performance
AI infrastructure enters multi-architecture fabric competition; Optical-copper interconnects and supply-chain coordination determine system performance
Thursday 13 August 2026
Taiwan notebook industry, 2Q 2026
Taiwan notebook industry, 2Q 2026
Tuesday 11 August 2026
AI infrastructure moves toward scale-across; demand for coherent optics supply chain heats up
AI infrastructure moves toward scale-across; demand for coherent optics supply chain heats up
Thursday 6 August 2026
Global smartphone AP industry, 2Q 2026: 2nm and memory costs to weigh on 3Q26 shipments
Global smartphone AP industry, 2Q 2026: 2nm and memory costs to weigh on 3Q26 shipments
Members only
×
Sorry, the page you are trying to open is available only for our paid subscribers.
Please
login
to read more
New users, please
register
first